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Research Spending & Results

Award Detail

Awardee:UNIVERSITY OF MISSOURI SYSTEM
Doing Business As Name:Missouri University of Science and Technology
PD/PI:
  • Jun Fan
  • (573) 341-4134
  • jfan@mst.edu
Co-PD(s)/co-PI(s):
  • Todd H Hubing
Award Date:02/06/2009
Estimated Total Award Amount: $ 345,000
Funds Obligated to Date: $ 470,976
  • FY 2014=$8,000
  • FY 2011=$96,985
  • FY 2009=$118,995
  • FY 2010=$69,000
  • FY 2013=$177,996
Start Date:02/15/2009
End Date:01/31/2015
Transaction Type:Grant
Agency:NSF
Awarding Agency Code:4900
Funding Agency Code:4900
CFDA Number:47.041
Primary Program Source:040100 NSF RESEARCH & RELATED ACTIVIT
Award Title or Description:Center for Electromagnetic Compatibility
Federal Award ID Number:0855878
DUNS ID:804883767
Parent DUNS ID:006326904
Program:IUCRC-Indust-Univ Coop Res Ctr

Awardee Location

Street:300 W 12th Street
City:Rolla
State:MO
ZIP:65409-6506
County:Rolla
Country:US
Awardee Cong. District:08

Primary Place of Performance

Organization Name:Missouri University of Science and Technology
Street:300 W 12th Street
City:Rolla
State:MO
ZIP:65409-6506
County:Rolla
Country:US
Cong. District:08

Abstract at Time of Award

Full Center Proposal (Phase I) for an I/UCRC for Electromagnetic Compatibility 0855878 Missouri University of Science and Technology; Richard DuBroff 0856085 University of Houston; Ji Chen The proposal concerns the formation of a new I/UCRC "Electromagnetic Compatibility" consisting of the Missouri University of Science and Technology (MST) and the University of Houston (UH). MST is the lead institution of the proposed Center, and proposes to add two additional sites (University of Oklahoma and Clemson University) in the next review cycle. Electromagnetic Compatibility (EMC) is an essential feature of virtually all high speed digital electronic assistants and home entertainment centers to essential control and information processing systems. EMC is the ability of these electronic systems to function reliably without causing interference to other electronic systems, being overly sensitive to weak signals generated by other electronic systems, and generating signals in one part of the system interfering with the operation of another part of the same system. The Center and its research activities will involve faculty, students and industrial representatives; and the industrial-focused research program will enhance the scientific understanding and help address a potentially significant health and environmental problem. The proposed Center will encourage collaboration amongst the four institutions, and is committed to providing a skilled and diverse workforce in the area of EMC as required by industry. The research will expose students and faculty to state-of-the-art research projects of value to the industry. The close collaboration with various industry partners will help establish a strong research base to enable development of consumer electronics and control and information systems. The proposing institutions have a track record of increasing the participation of under-represented groups in research and education. In addition, the proposal emphasizes increased recruitment of students from under-represented groups.

Publications Produced as a Result of this Research

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Koledintseva, M. Y., A. V. Rakov, A.I. Koledintsev, J.L. Drewniak "Improved Experiment-Based Technique to Characterize Dielectric Properties of Printed Circuit Boards" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1559. doi:10.1109/TEMC.2014.2317812 

Muller, S.; Xiaomin Duan; Kotzev, M.; Yao-Jiang Zhang; Jun Fan; Xiaoxiong Gu; Kwark, Y.H.; Rimolo-Donadio, R.; Bruns, H.-D.; Schuster, C. "Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays" IEEE Transaction on Electromagnetic Compatibility, v.54, 2012, p.1115.

Jianfeng Xu, Koledintseva, M. Y; Yaojiang Zhang; Yongxue He; Matlin, B; DuBroff, R. E.; Drewniak, J. L. ;Jianmin Zhang "Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials" IEEE Transactions on Electromagnetic Compatibility, v.52, 2010, p.878. doi:10.1109/TEMC.2010.2050693 

Haixiao, Weng;Beetner, D. G.;DuBroff, R. E.; "Prediction of Radiated Emissions Using Near-Field Measurements" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.891-899.

Jayong Koo, Lijun Han, Scott Herrin, Richard Moseley, Ross Carlton, Daryl G Beetner, David Pommerenke "A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients" IEEE Transactions on Electromagnetic Compatibility, v.51, 2009, p.611. doi:August 2009 

Marina Y. Koledintseva, Sandeep K. Patil, Robert W. Schwartz, Wayne Huebner, Konstatin N. Rozanov, Jianxiang Shen, Ji Chen "Prediction of Effective Permittivity of Diphasic Dielectrics as a Function of Frequency" IEEE Transactions on Dielectrics and Electrical Insulation, v.16, 2009, p.793. doi:June 2009 

Smith, W.S.; Razmadze, A.; Xuan-Min Shao; Drewniak, J.L. "A Hierarchy of Explicit Low-Dispersion FDTD Methods for Electrically Large Problems IEEE Transactions on Antennas and Propagation" IEEE Transactions on Antennas and Propagation, v.60, 2012, p.5787.

Zhang, J. Kam, K. W. Min, J. Khilkevich, V. V. Pommerenke, D. Fan, J. "An effective method of probe calibration in phase-resolved near-field scanning for EMI application" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.648. doi:10.1109/tim.2012.2218678 

Ji Zhang, Xiang Li, Richard Moseley, David Pommerenke, Daryl G. Beetner "Predicting Field Coupling to an IC Using Measured Coupling Factors" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1287. doi:10.1109/TEMC.2014.2355719 

Xiaopeng, Dong;Haixiao, Weng;Beetner, D. G.;Hubing, T. H.; "Approximation of Worst Case Crosstalk at High Frequencies" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.202-208.

Jingook, Kim;Jun, Fan;Ruehli, A. E.;Joungho, Kim;Drewniak, J. L. "Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances" Microwave Theory and Techniques, IEEE Transactions on, v.59, 2011, p.1909.

Wang, H. Pan, S. Kim, J. Ruehli, A. E. Fan, J. "Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.3, 2013, p.2134. doi:10.1109/tcpmt.2013.2272323 

4. Renato Rimolo-Donadio, Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Bruce Archambeault, Francesco de Paulis, Yaojiang Zhang, Jun Fan, Heinz-Dietric Bruns, Christian Schuster "Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz" IEEE Transactions on Microwave Theory and Techniques, v.57, 2009, p.2072.

Meilin Wu, Daryl G. Beetner, Todd H. Hubing, Haixin Ke, Shishuang Sun "Statistical Prediction of "Reasonable Worst-Case" Crosstalk in Cable Bundles" IEEE Transactions on Electromagnetic Compatibility, v.51, 2009, p.842. doi:August 2009 

Wang, H. Fan, J. "Modeling local via structures using innovative PEEC formulation based on cavity Green's functions with wave port excitation" IEEE Transactions on Microwave Theory and Techniques, v.61, 2013, p.1748. doi:10.1109/TMTT.2013.2253791 

Siming Pan, Jun Fan "Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model" IEEE Transactions on Electromagnetic Compatibility, v.54, 2012, p.1077. doi:10.1109/TEMC.2012.2187664 

Yao-Jiang Zhang; Jun Fan "A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair" IEEE Transactions on Microwave Theory and Techniques, v.60(7), 2012, p.2035. doi:10.1109/TMTT.2012.2195195 

Hanfeng, Wang Khilkevich, V. Yao-Jiang, Zhang Jun, Fan "Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.1125. doi:10.1109/temc.2013.2248090 

Bhargava, A.;Pommerenke, D.;Kam, K. W.;Centola, F.;Cheng Wei, Lam; "DC-DC Buck Converter EMI Reduction Using PCB Layout Modification" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.806-813.

Koo, J; Cai, Q; Wang, K; Maas, J; Takahashi, T; Martwick, A; Pommerenke, D "Correlation Between EUT Failure Levels and ESD Generator Parameters" IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.50, 2008, p.794. doi:10.1109/TEMC.2008.200540  View record at Web of Science

Koo, JY; Han, LJ; Herrin, S; Moseley, R; Carlton, R; Beetner, DG; Pommerenke, D "A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients" IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.51, 2009, p.611. doi:10.1109/TEMC.2009.202367  View record at Web of Science

Jingook, Kim;Shringarpure, K.;Jun, Fan;Joungho, Kim;Drewniak, J. L.; "Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays" Microwave and Wireless Components Letters, IEEE, v.21, 2011, p.62-64.

Shishuang Sun, David J. Pommerenke, James L Drewniak, Genda Chen, Liang Xue, Michael A. Brower, Marina Y. Koledintseva "A Novel TDR-Based Coaxial Cable Sensor for Crack/Strain Sensing in Reinforced Concrete Structures" IEEE Transactions on Instrumentation and Measurement, v.58, 2009, p.2714.

Jingook Kim; Liang Li; Songping Wu; Hanfeng Wang; Takita, Y.; Takeuchi, H.; Araki, K.; Fan, J.; Drewniak, J.L. "Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network" IEEE Transactions on Electromagnetic Compatibility, v.54 (5), 2012, p.1112. doi:10.1109/TEMC.2012.2194786 

Zhang, J.; Kam, K. W.; Min, J.; Khilkevich, V. V.; Pommerenke, D.; Fan, J. "An Effective Method of Probe Calibration in Phase-Resolved Near-Field Scanning for EMI Application" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.648. doi:10.1109/TIM.2012.2218678 

Li, T. Pommerenke, D. J. Zhang, J. Hu, K. "A current probe for measuring the individual ball current in a ball-grid-array packaged device" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.3323. doi:00189456 (ISSN) 

Smith, W.S.; Razmadze, A.; Xuan-Min Shao; Drewniak, J.L. "A Hierarchy of Explicit Low-Dispersion FDTD Methods for Electrically Large Problems IEEE Transactions on Antennas and Propagation" IEEE Transactions on Antennas and Propagation, v.60(12), 2012, p.5787. doi:10.1109/TAP.2012.2209860 

Archambeault, B. Connor, S. Halligan, M. S. Drewniak, J. L. Ruehli, A. E. "Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.614. doi:10.1109/temc.2013.2261736 

Chuang, H. H. Li, G. H. Song, E. Park, H. H. Jang, H. T. Park, H. B. Zhang, Y. J. Pommerenke, D. Wu, T. L. Fan, J. "A magnetic-field resonant probe with enhanced sensitivity for RF interference applications" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.991. doi:10.1109/temc.2013.2248011 

Wan, F. Pilla, V. Li, J. Pommerenke, D. Shumiya, H. Araki, K. "Time Lag of Secondary ESD in Millimeter-Size Spark Gaps" IEEE Transactions on Electromagnetic Compatibility, v.56, 2014, p.28. doi:10.1109/TEMC.2013.2275922 

Renato Rimolo-Donadio, Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Bruce Archambeault, Francesco de Paulis, Yaojiang Zhang, Jun Fan, Heinz-Dietric Bruns, Christian Schuster "Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz" IEEE Transactions on Microwave Theory and Techniques, v.57, 2009, p.2072. doi:August 2009 

Kam, K. W. Radchenko, A. Pommerenke, D. "On Different Approaches to Combine Cable Information Into Near-Field Data for Radiated-Field Estimation" IEEE Transactions on Electromagnetic Compatibility, v.56, 2014, p.276. doi:10.1109/TEMC.2013.2286201 

Guanghua, Li., Koichi. Itou,Yoshihiro Katou, Noriyuki Mukai, D, Pommerenke, J, Fan "A Resonant E-Field Probe for RFI Measurements" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1719. doi:10.1109/TEMC.2014.2354018 

De Paulis, F. Nisanci, M. H. Orlandi, A. Koledintseva, M. Y. Drewniak, J. L. "Design of Homogeneous and Composite Materials From Shielding Effectiveness Specifications" Electromagnetic Compatibility, IEEE Transactions on., v.56, 2014, p.343.

Wang, H. Fan, J. "Modeling local via structures using innovative PEEC formulation based on cavity Green's functions with wave port excitation" IEEE Transactions on Microwave Theory and Techniques, v.61, 2013, p.1748.

Jingook, Kim;Jun, Fan;Ruehli, A. E.;Joungho, Kim;Drewniak, J. L.; "Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances" Microwave Theory and Techniques, IEEE Transactions on, v.59, 2011, p.1909-1924.

Jianfeng Xu, Koledintseva, M. Y; Yaojiang Zhang; Yongxue He; Matlin, B; DuBroff, R. E.; Drewniak, J. L. ;Jianmin Zhang "Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials" IEEE Transactions on Electromagnetic Compatibility, v.52, 2010, p.878. doi:10.1109/TEMC.2010.2050693 

Reck, J.N.; Kuifeng Hu; Shaohua Li; Haixiao Weng; Beetner, D.G.; O'Keefe, M.J.; Ramsay, D.S.; Drewniak, J.L. "Fabrication of Two-Layer Thin-Film Magnetic-Field Microprobes on Freestanding SU-8 Photoepoxy" IEEE Transactions on Device and Material Reliability, v.10, 2010, p.26. doi:10.1109/TDMR.2009.2033382 

Hongyu, Li., Victor. V. Khilkevich, David. Pommerenke "Identification and Visualization of Coupling Paths---Part I: Energy Parcel and Its Trajectory" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.622. doi:10.1109/TEMC.2014.2314645 

Jingook, Kim Takita, Y. Araki, K. Jun, Fan "Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.3, 2013, p.1554. doi:10.1109/tcpmt.2012.2232353 

Li, T. Pommerenke, D. J. Zhang, J. Hu, K. "A current probe for measuring the individual ball current in a ball-grid-array packaged device" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.3323. doi:10.1109/TIM.2013.2272863 

Nisanci, M. H.;de Paulis, F.;Koledintseva, M. Y.;Drewniak, J. L.;Orlandi, A.; "From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics---Part II: Random Cylindrical Inclusions" Electromagnetic Compatibility, IEEE Transactions on, v.PP, 2011, p.1-10.

Keong, Kam;Pommerenke, D.;Bhargava, A.;Steinfeld, B.;Cheung-wei, Lam;Centola, F.; "Quantification of Self-Damping of Power MOSFET in a Synchronous Buck Converter" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.1091-1093.

Yu, Z. Mix, J. A. Sajuyigbe, S. Slattery, K. P. Fan, J. "An improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.97. doi:10.1109/temc.2012.2207726 

Jingook Kim, Jongjoo Lee, Seungyoung Ahn, Jun Fan "Closed-Form Expressions for the Noise Voltage Caused by a Burst Train of IC Switching Currents on a Power Distribution Network" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1585. doi:10.1109/TEMC.2014.2315837 

Ji, Zhang. Jayong Koo, Richard Moseley, Scott Herrin, Xiang Li, David Pommerenke, Daryl G. Beetner "Modeling Injection of Electrical Fast Transients Into Power and IO Pins of ICs" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1576. doi:10.1109/TEMC.2014.2332499 

Wei, Yu., Yihong Qi, Kefeng Liu, Yangguang Xu "Radiated Two-Stage Method for LTE MIMO User Equipment Performance Evaluation" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1691. doi:10.1109/TEMC.2014.2320779 

Bhargava, A.; Pommerenke, D.; Kam, K. W.; Centola, F.; Cheng Wei Lam "DC-DC Buck Converter EMI Reduction Using PCB Layout Modification" IEEE Transactions on Electromagnetic Compatibility, v.53, 2011, p.806.

Koledintseva, M. Y.;Jianfeng, Xu;De, S.;Drewniak, J. L.;Yongxue, He;Johnson, R.; "Systematic Analysis and Engineering of Absorbing Materials Containing Magnetic Inclusions for EMC Applications" Magnetics, IEEE Transactions on, v.47, 2011, p.317-323.

Kuifeng, Hu;Haixiao, Weng;Beetner, D. G.;Pommerenke, D.;Drewniak, J. "Unbalanced Currents in Integrated Circuits and Their Effect on TEM Cell Emissions" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.600.

Keong, Kam;Pommerenke, D.;Bhargava, A.;Steinfeld, B.;Cheung-wei, Lam;Centola, F. "Quantification of Self-Damping of Power MOSFET in a Synchronous Buck Converter" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.1091.

Yaojiang Zhang, Renato Rimolo-Donadio, Jun Fan, Christian Schuster, Erping Li "Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method" IEEE Microwave and Wireless Components Letters, v.19, 2009, p.275.

Bishop, J. A.; Pommerenke, D. J.; Chen, G. "A Rapid-Acquisition Electrical Time-Domain Reflectometer for Dynamic Structure Analysis" IEEE Transactions on Instrumentation and Measurement, v.60, 2011, p.655. doi:10.1109/TIM.2010.2058551 

Wan, F. Ge, J. X. Pommerenke, D "Absolute humidity, relative humidity: Which is more important in representing severity of electrostatic discharge" Electronics Letters, v.49, 2013, p.1451.

Xiaopeng, Dong;Haixiao, Weng;Beetner, D. G.;Hubing, T. H. "Approximation of Worst Case Crosstalk at High Frequencies" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.202.

Koo, JY; Han, LJ; Herrin, S; Moseley, R; Carlton, R; Beetner, DG; Pommerenke, D "A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients" IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.51, 2009, p.611. doi:10.1109/TEMC.2009.202367 

Meilin Wu, Daryl G. Beetner, Todd H. Hubing, Haixin Ke, Shishuang Sun "Statistical Prediction of "Reasonable Worst-Case" Crosstalk in Cable Bundles" IEEE Transactions on Electromagnetic Compatibility, v.51, 2009, p.842.

Dazhao, Liu;Nandy, A.;Fan, Zhou;Wei, Huang;Jiang, Xiao;Byongsu, Seol;Jongsung, Lee;Jun, Fan;Pommerenke, D.; "Full-Wave Simulation of an Electrostatic Discharge Generator Discharging in Air-Discharge Mode Into a Product" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.28-37.

Yu, Z. Mix, J. A. Sajuyigbe, S. Slattery, K. P. Pommerenke, D. Fan, J. "Heat-sink modeling and design with dipole moments representing IC excitation" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.168. doi:10.1109/temc.2012.2210720 

Shishuang Sun, David J. Pommerenke, James L Drewniak, Genda Chen, Liang Xue, Michael A. Brower, Marina Y. Koledintseva "A Novel TDR-Based Coaxial Cable Sensor for Crack/Strain Sensing in Reinforced Concrete Structures" IEEE Transactions on Instrumentation and Measurement, v.58, 2009, p.2714. doi:August 2009 

Wan, F. Pommerenke, D. Shumiya, H. Araki, K. "Effect of spark gap shape on time lag" Electronics Letters, v.49, 2013, p.795.

9. Jianmin Zhang; Drewniak, J.L.; Pommerenke, D.J.; Koledintseva, M.Y.; DuBroff, R.E.; Cheng, W.; Zhiping Yang; Chen, Q.B.; Orlandi, A. "Causal RLGC( f ) Models for Transmission Lines From Measured S -Parameters" IEEE Transactions on Electromagnetic Compatibility, v.52, 2010, p.189. doi:10.1109/TEMC.2009.2035055 

Archambeault, B. Connor, S. Halligan, M. S. Drewniak, J. L. Ruehli, A. E. "Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.614. doi:10.1109/temc.2013.2261736 

Marina Y. Koledintseva, Sandeep K. Patil, Robert W. Schwartz, Wayne Huebner, Konstatin N. Rozanov, Jianxiang Shen, Ji Chen "Prediction of Effective Permittivity of Diphasic Dielectrics as a Function of Frequency" IEEE Transactions on Dielectrics and Electrical Insulation, v.16, 2009, p.793.

MuÌ?ller, S.; Xiaomin Duan; Kotzev, M.; Yao-Jiang Zhang; Jun Fan; Xiaoxiong Gu; Kwark, Y.H.; Rimolo-Donadio, R.; BruÌ?ns, H.-D.; Schuster, C. "Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays" IEEE Transaction on Electromagnetic Compatibility, v.54 (5), 2012, p.1125. doi:10.1109/TEMC.2012.2192123 

Jingook, Kim Takita, Y. Araki, K. Jun, Fan "Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.3, 2013, p.1154. doi:10.1109/tcpmt.2012.2232353 

de Paulis, F.;Nisanci, M.;Koledintseva, M. Y.;Drewniak, J. L.;Orlandi, A.; "From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.933-942.

S. Wu, J. Fan "Modeling of Crosstalk Between Two Nonparallel Striplines on Adjacent Layers" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.1302. doi:10.1109/temc.2013.2265275 

Nisanci, M. H.;de Paulis, F.;Koledintseva, M. Y.;Drewniak, J. L.;Orlandi, A. "From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics---Part II: Random Cylindrical Inclusions" Electromagnetic Compatibility, IEEE Transactions on, v.54, 2012, p.280.

Hongyu, Li., Victor. V. Khilkevich, David. Pommerenke "Identification and Visualization of Coupling Paths---Part II: Practical Application" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.630. doi:10.1109/TEMC.2014.2314660 

Kuifeng, Hu;Haixiao, Weng;Beetner, D. G.;Pommerenke, D.;Drewniak, J.; "Unbalanced Currents in Integrated Circuits and Their Effect on TEM Cell Emissions" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.600-610.

Rimolo-Donadio, R.; Selli, G.; de Paulis, F.; Xiaoxiong Gu; Kwark, Y.H.; Drewniak, J.L.; Bruens, H.-D.; Schuster, C. "Signal integrity: Efficient, physics-based via modeling: Integration of striplines" IEEE Electromagnetic Compatibility Magazine, v.1(2), 2012, p.74. doi:10.1109/MEMC.2012.6244976 

Zhang, Y.-J.; Feng, G.; Fan, J. "A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model" IEEE Transactions on Microwave Theory and Techniques, v.58, 2010, p.3780. doi:10.1109/TMTT.2010.2083870 

Zhang, J; Koledintseva, MY; Drewniak, JL; Pommerenke, DJ; DuBroff, RE; Yang, Z; Cheng, W; Rozanov, KN; Antonini, G; Orlandi, A "Reconstruction of dispersive dielectric properties for PCB substrates using a genetic algorithm" IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.50, 2008, p.704. doi:10.1109/TEMC.2008.92792  View record at Web of Science

Haixiao, Weng;Beetner, D. G.;DuBroff, R. E.; "Frequency-Domain Probe Characterization and Compensation Using Reciprocity" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.2-10.

Wang, H. Pan, S. Kim, J. Ruehli, A. E. Fan, J. "Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.3, 2013, p.2134. doi:10.1109/tcpmt.2013.2272323 

Yao, W. Pan, S. Achkir, B. Fan, J. He, L. "Modeling and application of multi-port TSV networks in 3-D IC" IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, v.32, 2013, p.487.

Hwang, C. Kim, J. Achkir, B. Fan, J. "Analytical transfer functions relating power and ground voltage fluctuations to jitter at a single-ended full-swing buffer" IEEE Transactions on Components, Packaging and Manufacturing Technology, v.3, 2013, p.113. doi:10.1109/tcpmt.2012.2226723 

Yaojiang Zhang, Renato Rimolo-Donadio, Jun Fan, Christian Schuster, Erping Li "Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method" IEEE Microwave and Wireless Components Letters, v.19, 2009, p.275. doi:May 2009 

Hanfeng, Wang Khilkevich, V. Yao-Jiang, Zhang Jun, Fan "Estimating Radio-Frequency Interference to an Antenna Due to Near-Field Coupling Using Decomposition Method Based on Reciprocity" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.1125. doi:10.1109/temc.2013.2248090 

Jingook, Kim;Shringarpure, K.;Jun, Fan;Joungho, Kim;Drewniak, J. L. "Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays" Microwave and Wireless Components Letters, IEEE, v.21, 2011, p.62.

Colin Stagner, Daryl G. Beetner, Steven L. Grant "A Comparison of Algorithms for Detecting Synchronous Digital Devices Using Their Unintended Electromagnetic Emissions" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1304. doi:10.1109/TEMC.2014.2321391 

Yao-Jiang Zhang; Jun Fan "A Generalized Multiple Scattering Method for Dense Vias With Axially Anisotropic Modes in an Arbitrarily Shaped Plate Pair" IEEE Transactions on Microwave Theory and Techniques, v.60, 2012, p.2035. doi:10.1109/TMTT.2012.2195195 

Wan, F. Ge, J. X. Pommerenke, D. "Absolute humidity, relative humidity: Which is more important in representing severity of electrostatic discharge" Electronics Letters, v.49, 2013, p.1451. doi:10.1049/el.2013.1766 

Siming Pan, Jun Fan "Characterization of Via Structures in Multilayer Printed Circuit Boards With an Equivalent Transmission-Line Model" IEEE Transactions on Electromagnetic Compatibility, v.54(5), 2012, p.1077. doi:10.1109/TEMC.2012.2187664 

Stagner, C. Halligan, M. Osterwise, C. Beetner, D. G. Grant, S. L. "Locating noncooperative radio receivers using wideband stimulated emissions" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.667. doi:10.1109/tim.2012.2219141 

Jingook Kim; Liang Li; Songping Wu; Hanfeng Wang; Takita, Y.; Takeuchi, H.; Araki, K.; Fan, J.; Drewniak, J.L. "Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network" IEEE Transactions on Electromagnetic Compatibility, v.54, 2012, p.1112. doi:10.1109/TEMC.2012.2194786 

Haixiao, Weng;Beetner, D. G.;DuBroff, R. E. "Prediction of Radiated Emissions Using Near-Field Measurements" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.891.

Koledintseva, M. Y.;Jianfeng, Xu;De, S.;Drewniak, J. L.;Yongxue, He;Johnson, R. "Systematic Analysis and Engineering of Absorbing Materials Containing Magnetic Inclusions for EMC Applications" Magnetics, IEEE Transactions on, v.47, 2011, p.317.

Weng, H.; Beetner, D. G.; DuBroff, R. E. "Frequency-Domain Probe Characterization and Compensation Using Reciprocity" IEEE Transactions on Electromagnetic Compatibility, v.53, 2011, p.2. doi:10.1109/TEMC.2010.2059030 

Zhang, Y.-J.; Feng, G.; Fan, J. "A Novel Impedance Definition of a Parallel Plate Pair for an Intrinsic Via Circuit Model" IEEE Transactions on Microwave Theory and Techniques, v.58, 2010, p.3780. doi:10.1109/TMTT.2010.2083870 

Halligan, M. S. and D. G. Beetner "Maximum Crosstalk Estimation in Weakly Coupled Transmission Lines" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.736. doi:10.1109/TEMC.2014.2304735 

Huang, J. Wang, T. Hua, L. Fan, J. Xiao, H. Luo, M. "A coaxial cable fabry-perot interferometer for sensing applications" Sensors (Switzerland), v.13, 2013, p.15252. doi:14248220 

de Paulis, F.;Nisanci, M.;Koledintseva, M. Y.;Drewniak, J. L.;Orlandi, A. "From Maxwell Garnett to Debye Model for Electromagnetic Simulation of Composite Dielectrics Part I: Random Spherical Inclusions" Electromagnetic Compatibility, IEEE Transactions on, v.53, 2011, p.933.

Yu, Z. Mix, J. A. Sajuyigbe, S. Slattery, K. P. Pommerenke, D. Fan, J. "Heat-sink modeling and design with dipole moments representing IC excitation" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.168. doi:10.1109/temc.2012.2210720 

Songping, Wu Jun, Fan "Modeling of Crosstalk Between Two Nonparallel Striplines on Adjacent Layers" Electromagnetic Compatibility, IEEE Transactions on, v.55, 2013, p.1302. doi:10.1109/temc.2013.2265275 

Jianmin Zhang; Drewniak, J.L.; Pommerenke, D.J.; Koledintseva, M.Y.; DuBroff, R.E.; Cheng, W.; Zhiping Yang; Chen, Q.B.; Orlandi, A. "Causal RLGC( f ) Models for Transmission Lines From Measured S -Parameters" IEEE Transactions on Electromagnetic Compatibility, v.52, 2010, p.189. doi:10.1109/TEMC.2009.2035055 

Stagner, C. Halligan, M. Osterwise, C. Beetner, D. G. Grant, S. L. "Locating noncooperative radio receivers using wideband stimulated emissions" IEEE Transactions on Instrumentation and Measurement, v.62, 2013, p.667. doi:10.1109/tim.2012.2219141 

Chuang, H. H. Li, G. H. Song, E. Park, H. H. Jang, H. T. Park, H. B. Zhang, Y. J. Pommerenke, D. Wu, T. L. Fan, J. "A magnetic-field resonant probe with enhanced sensitivity for RF interference applications" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.991. doi:10.1109/temc.2013.2248011 

Rimolo-Donadio, R.; Selli, G.; de Paulis, F.; Xiaoxiong Gu; Kwark, Y.H.; Drewniak, J.L.; Bruens, H.-D.; Schuster, C. "Signal integrity: Efficient, physics-based via modeling: Integration of striplines" IEEE Electromagnetic Compatibility Magazine, v.1, 2012, p.74.

Yu, Z. Mix, J. A. Sajuyigbe, S. Slattery, K. P. Fan, J. "An improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC" IEEE Transactions on Electromagnetic Compatibility, v.55, 2013, p.97. doi:10.1109/temc.2012.2207726 

Yao, W. Pan, S. Achkir, B. Fan, J. He, L. "Modeling and application of multi-port TSV networks in 3-D IC" IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, v.32, 2013, p.487. doi:10.1109/tcad.2012.2228740 

Xu, Gao., Jun Fan, Yaojiang Zhang, Hamed Kajbaf, Daved Pommerenke "Far-Field Prediction Using Only Magnetic Near-Field Scanning for EMI Test" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1335. doi:10.1109/TEMC.2014.2322081 

Hwang, C. Kim, J. Achkir, B. Fan, J. "Analytical transfer functions relating power and ground voltage fluctuations to jitter at a single-ended full-swing buffer" IEEE Transactions on Components, Packaging and Manufacturing Technology, v.3, 2013, p.113. doi:10.1109/tcpmt.2012.2226723 

Reck, J.N.; Kuifeng Hu; Shaohua Li; Haixiao Weng; Beetner, D.G.; O'Keefe, M.J.; Ramsay, D.S.; Drewniak, J.L. "Fabrication of Two-Layer Thin-Film Magnetic-Field Microprobes on Freestanding SU-8 Photoepoxy" IEEE Transactions on Device and Material Reliability, v.10, 2010, p.26. doi:10.1109/TDMR.2009.2033382 

Wan, F. Pommerenke, D. Shumiya, H. Araki, K. "Effect of spark gap shape on time lag" Electronics Letters, v.49, 2013, p.795. doi:10.1049/el.2013.1453 

Liu, D.; Nandy, A.; Zhou, F.; Huang, W.; Xiao, J.; Seol, B.; Lee, J.; Fan, J.; Pommerenke, D. "Full-Wave Simulation of an Electrostatic Discharge Generator Discharging in Air-Discharge Mode Into a Product" IEEE Transactions on Electromagnetic Compatibility, v.53, 2011, p.28. doi:10.1109/TEMC.2010.2087025 

Halligan, M. S. and D. G. Beetner "Maximum Crosstalk Estimation in Lossless and Homogeneous Transmission Lines" Microwave Theory and Techniques, IEEE Transactions on, v.62, 2014, p.1953. doi:10.1109/TMTT.2014.2328975 

Peng Shao, Frank Chang, Chris Reade, Ponniah Ilavarasan, David PommerenkePommerenke, Daryl G. Beetner "An Experimental Approach for Locating the Current Distribution in Multiphase Buck Converters" Electromagnetic Compatibility, IEEE Transactions on, v.56, 2014, p.1344. doi:10.1109/TEMC.2014.2343834 

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