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Research Spending & Results

Award Detail

Awardee:AUBURN UNIVERSITY
Doing Business As Name:Auburn University
PD/PI:
  • Pradeep Lall
  • (334) 844-3424
  • lall@auburn.edu
Co-PD(s)/co-PI(s):
  • Jeffrey C Suhling
  • John L Evans
  • George T Flowers
  • Michael J Bozack
Award Date:12/29/2009
Estimated Total Award Amount: $ 145,000
Funds Obligated to Date: $ 4,990,132
  • FY 2013=$915,750
  • FY 2016=$131,096
  • FY 2014=$566,279
  • FY 2015=$1,657,550
  • FY 2010=$447,756
  • FY 2012=$1,035,323
  • FY 2011=$236,378
Start Date:01/01/2010
End Date:12/31/2016
Transaction Type:Grant
Agency:NSF
Awarding Agency Code:4900
Funding Agency Code:4900
CFDA Number:47.041
Primary Program Source:040100 NSF RESEARCH & RELATED ACTIVIT
Award Title or Description:Phase-III: Center for Advanced Vehicle and Extreme Environment Electronics
Federal Award ID Number:0968381
DUNS ID:066470972
Parent DUNS ID:066470972
Program:IUCRC-Indust-Univ Coop Res Ctr
Program Officer:
  • Prakash Balan
  • (703) 292-5341
  • pbalan@nsf.gov

Awardee Location

Street:VPRED, Research & Innovation Ctr
City:Auburn
State:AL
ZIP:36832-0001
County:
Country:US
Awardee Cong. District:03

Primary Place of Performance

Organization Name:Auburn University
Street:VPRED, Research & Innovation Ctr
City:Auburn
State:AL
ZIP:36832-0001
Country:US
Cong. District:03

Abstract at Time of Award

0968381 Auburn University; Pradeep Lall CAVE is proposing a Phase III support (third five-year period) for the Center, including support for center personnel, evaluation and research. The proposed Center is a single-university Center at Auburn University. CAVE, founded in September 1999, is a research organization in new technologies for electronics packaging, reliability, prognostics, and manufacturing related to harsh environment applications. CAVE addresses both fundamental scientific issues and the critical needs for operation in extreme environments. CAVE is poised to continue its contributions to the development of a US core competence in design and manufacturing of electronics for harsh environments through its focused membership, experienced faculty, and state-of-the-art facilities. The Center membership included major automotive, aerospace, and defense electronics OEMs, as well as their supply infrastructure including manufacturers of printed wiring boards, components, electronics materials, and assembly equipment. The Center will continue to develop and implement new technologies for the packaging and manufacturing of electronics, with emphasis on the reliability, prognostics, and cost effectiveness in harsh environments. The Center proposes to integrate academic learning with industrial problems for students' education. The broader impacts of the CAVE Center research will be achieved through: special programs for middle school science teachers and students; broad dissemination of research findings through publications, workshops, short courses, and the www; partnering with industry and federal agencies; and, involvement of under-represented groups in undergraduate and graduate research projects.

Publications Produced as a Result of this Research

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Lall, P; Panchagade, DR; Iyengar, D; Shantaram, S; Schrier, H "High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, 2009, p.378. doi:10.1109/TCAPT.2009.202091  View record at Web of Science

Lall, P., Mirza, K., "A Study on the Effect of Mean Cyclic Temperature on the Thermal Fatigue Reliability of SAC Solder Joints Using Digital Image Correlation" Proceedings of the ASME IMECE, Houston, TX, v., 2015, p.pp.1-11.

Bozack M., Suhling J., Zhang Y., Cai Z., Lall P. "Surfaces of Mixed Formulation Solder Alloys at Melting" Journal of Vacuum Science Technology, v.29, 2011, p.041401. doi:10.1116/1.3584821 

Lall, P.; Lowe, R.; Goebel, K. "Extended Kalman Filter Models and Resistance Spectroscopy for Prognostication and Health Monitoring of Leadfree Electronics Under Vibration" Reliability, IEEE Transactions on, v.61, 2012, p.858. doi:10.1109/TR.2012.2220698 

Lall, P., Zhang, D., Suhling, J., Locker, D., "Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature" Proceedings of the ASME IMECE, Houston, TX, v., 2015, p.. doi:Paper Number: IMECE2015?53751 

Lall, P., K. Mirza, M. Harsha, K. Goebel, "Microstructural Indicators for Assessment of Effect of Prolonged and Intermittent Storage on Reliability of Lead-free Electronics" IEEE Transactions on Device and Materials Reliability, v.16, 2016, p.304. doi:10.1109/TDMR.2016.2597740 

Lall, P., Zhang, H., "Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter" ASME Journal of Electronic Packaging, v.137, 2015, p.. doi:10.1115/1.4028957 

Basit, M., M. Motalab, J. C. Suhling, J. L. Evans, P. Lall, "FEA Based Reliability Predictions For Pbga Packages Subjected To Isothermal Aging Prior To Thermal Cycling" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48620, Session 1-6-4 

Lall, P., Dornala, V.K.R., Wei, J., Lowe, R., Foley, J., "Prognostication of Solder-Joint Reliability of 0.4mm and 0.5mm Pitch BGAs Subjected to Mechanical Shocks up to 10,000G" Proceedings of the IEEE International Conference on Prognostics Health Management, Austin, TX, v., 2015, p..

Lall, P; Iyengar, D; Shantaram, S; Pandher, R; Panchagade, D "Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration" IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, 2009, p.311. doi:10.1109/TEPM.2009.203187  View record at Web of Science

Basit, M., M. Motalab, J. C. Suhling, Z. Hai, J. Evans, M. Bozack, and P. Lall, "Thermal Cycling Reliability of Aged PBGA Assemblies- Comparison of Weibull Failure Data and Finite Element Model Predictions" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 106-1.

Pradeep Lall, Ryan Lowe, and Kai Goebel "Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact" J. Electron. Packag., v.134, 2012, p.021001-1.

Lall, P., Deshpande, S., Nguyen, L., "Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC?s" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48638; Session 14-2-1, 

Lall, P.; Gupta, P.; Kulkarni, M.; Hofmeister, J.; "Time-Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems" Electronics Packaging Manufacturing, IEEE Transactions on, v.33(4), 2010, p.289. doi:10.1109/TEPM.2010.2078824 

Lall, P., Patel, K., Narayan, K., "Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage" IEEE Transactions on Components, Packaging and Manufacturing Technology, v.5, 2015, p.1358.

Lall, P.; Blhat, C.; Hande, M.; More, V.; Vaidya, R.; Goebel, K.; "Prognostication of Residual Life and Latent Damage Assessment in Lead-free Electronics Under Thermo-Mechanical Loads" Industrial Electronics, IEEE Transactions on, v.99, 2010, p.. doi:10.1109/TIE.2010.2089936 

Lall, P., Wei, J., "Deformation and Strain Measurement in Operational Electronics Using X-Ray Micro-CT and Digital Volume Correlation" Proceedings of the SMTAI International Conference, Rosemont, IL, v., 2015, p.pp. 515-5.

Lall, P; Choudhary, P; Gupte, S; Hofmeister, J "Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, 2009, p.600. doi:10.1109/TCAPT.2009.202642  View record at Web of Science

Ahmed, S., M. Basit, J. C. Suhling, P. Lall, "Characterization of Doped SAC Solder Materials and Determination of Anand Parameters" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48624, 14-2-2 

Lall, P., and H. Zhang, L. Davis, "Failure Mechanisms and Color Stability in Light-Emitting Diodes during Operations in High-Temperature Environments in Presence of Contamination" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 1624-.

Pradeep Lall, Aniket Shirgaokar, and Dinesh Arunachalam "Norris-Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics" J. Electron. Packag., v.134, 2012, p.031008-1.

Lall, P., Vaidya, R., More, V., Goebel, K. "ASSESSMENT OF ACCRUED THERMO-MECHANICAL DAMAGE IN LEADFREE PARTS DURING FIELD-EXPOSURE TO MULTIPLE ENVIRONMENTS" Journal of SMTA, v.23(2), 2010, p.11.

Lall, P., Wei, J., "Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models" IEEE Transactions on Device and Materials Reliability, v.15, 2015, p.54 - 68.

Chowdhury, P. R., N. J. Chhanda, J. C. Suhling, P. Lall, "Experimental Characterization Of Underfill Materials Exposed To Moisture Including Preconditioning" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48622, 14-3-1 

Lall, P; Gupte, S; Choudhary, P; Darveaux, R "Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, 2009, p.365. doi:10.1109/TCAPT.2008.201213  View record at Web of Science

Lall, P., Limaye, G., "SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments" Journal of the SMTA, v.26, 2013, p..

Lall, P., Lowe, R., "Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration" ASME Journal of Electronic Packaging, v.136, 2014, p..

Lall, P., Abrol, A., Simpson, L., Glover, J., "Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Shock Environments" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48790; Session 3-1-1 

Bozack M., Suhling J., Zhang Y., Cai Z., Lall P., "Influence of Surface Segregation on Wetting of SAC (Sn-Ag-Cu) Series Solder Alloys" Journal of Electronic Materials, v.40, 2011, p.2093. doi:10.1007/s11664-011-1725-7 

Lall, P., Luo, Y., Nguyen, L., "Corrosion and Contaminant Diffusion Multi-Physics Model for Copper-Aluminum Wirebonds in High Temperature High Humidity Environments" Proceedings of the SMTAI International Conference, Rosemont, IL, v., 2015, p.pp. 14-27.

Lall, P., Mirza, K., "Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure" SMTA Journal, v.28, 2015, p.28.

Lall, P., Wei, J., Sakalaukus, P., "Life Prediction and Classification of Fault Modes in Solid State Lamps using Bayesian Probabilistic Models" IEEE Reliability Digest, v.1, 2015, p.pp. 7-18.

Lall, P., Luo, Y., Nguyen, L., "Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages" Proceedings of the ASME IMECE, Houston, TX, v., 2015, p.. doi:Paper Number: IMECE2015?53742 

Lall, P.; Gupta, P.; Goebel, K. "Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock" Reliability, IEEE Transactions on, v.61, 2012, p.884. doi:10.1109/TR.2012.2222611 

Lall, P., Kothari, N., Glover, J., "Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48457; Session 3-3-2 

Lall, P., Luo, Y., Nguyen, L., "Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48639; Session 1-3-2 

Lall, P.; Vaidya, R.; More, V.; Goebel, K. "Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.2, 2012, p.634. doi:10.1109/TCPMT.2011.2176491 

Lall, P., Zhang, D., Yadav, V., Locker, D., "KEYNOTE PRESENTATION: High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature" Proceedings of the EuroSIME, Budapest, Hungary, v., 2015, p..

Lall, P., S. M. Duraisamy, J. Suhling, J. Evans, "Principal Components Regression Model for Prediction of Life-Reduction in SAC Lead Free Interconnects During Long-Term High Temperature Storage" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 2040-.

Lall, P., Y. Luo, L. Nguyen, "Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 1045-.

Lall, P.; Lowe, R.; Goebel, K. "Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics" Industrial Electronics, IEEE Transactions on, v.59, 2012, p.4301. doi:10.1109/TIE.2012.2183834 

Lall, P., Shantaram, S., Suhling, J., Locker, D., "Stress-Strain Behavior of SAC305 at High Strain Rates," ASME Journal of Electronic Packaging, v.137, 2015, p.. doi:10.1115/1.4028641 

Lall, P., Wei, J., "Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models" IEEE Transactions on Device and Materials Reliability, v.15, 2015, p.. doi:10.1109/TDMR.2014.2369859 

Lall, P., Zhang, H., Davis, L., "Discoloration and Failure Mechanism Analysis of High Power pc-LED Under Harsh Environment in Presence of Contamination" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48724; Session 1-5-1 

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, "Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48626, 1-6-1 

Lall, P; Islam, N; Choudhary, P; Suhling, JC "Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.32, 2009, p.135. doi:10.1109/TCAPT.2008.201212  View record at Web of Science

Lall, P., Mirza, K., Suhling, J., "DIC Based Investigation into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48727, Session 14-5-1 

Basit, M., M. Motalab, J. C. Suhling, P. Lall, "Viscoplastic Constitutive Model For Lead-Free Solder Including Effects Of Silver Content, Solidification Profile and Severe Aging" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48619, Session 14-2-2 

Lall, P., D. Zhang, and J. Suhling, "High Strain Rate Properties of SAC305 Lead Free Solder at High Operating Temperature after Long-Term Storage" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 640-6.

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, and Pradeep Lall "Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping" J. Electron. Packag., v.134, 2012, p.031005-1.

Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, "Characterization of The Effects of Silver Content on The Aging Resistance of SAC Solder Joints" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48623, 14-5-1 

Lall, P., Wei, J., "LED Chip Deformation Measurement During the Operation Using the X-ray CT Digital Volume Correlation" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48785; Session 14-5-1 

Lall, P., Wei, J., Sakalaukus, P., "KEYNOTE PRESENTATION: Bayesian Models for Life Prediction and Fault-Mode Classification in Solid State Lamps" Proceedings of the EuroSIME, Budapest, Hungary, v., 2015, p..

Lall, P., Sakalaukus, P., Davis, L., "Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging" IEEE Access Journal, v.3, 2015, p.pp. 531-5.

Lall, P., Zhang, H., Davis, L., "Prognostication of LED Remaining Useful Life and Color Stability in the Presence of Contamination" Proceedings of the IEEE International Conference on Prognostics Health Management, Austin, TX, v., 2015, p..

Lall, P., Sakalaukus, P., Davis, L., "An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48257; Session 1-5-1, 

Lall, P; Choudhary, P; Gupte, S; Suhling, JC "Health monitoring for damage initiation and progression during mechanical shock in electronic assemblies" IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, 2008, p.173. doi:10.1109/TCAPT.2008.91685  View record at Web of Science

Lall, P.; Gupta, P.; Angral, A. "Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration" Components, Packaging and Manufacturing Technology, IEEE Transactions on, v.2, 2012, p.1902. doi:10.1109/TCPMT.2012.2207460 

Lall, P., Zhang, D., Locker, D., "Damage Prediction in SAC305 Lead Free Electronics Subjected to Mechanical Shock After Long-Term Storage" Proceedings of the SMTAI International Conference, Rosemont, IL, v., 2015, p.pp. 904-9.

Lall, P., Yadav, V., Suhling, J., Locker, D., "A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures" ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, v., 2015, p.. doi:Paper IPACKICNMM2015-48389; Session 14-2-1 

Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, "Nanomechanical Characterization of SAC Solder Joints- Reduction of Aging Effects Using Microalloy Additions" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 1574-.

Lall, P., Deshpande, S., L. Nguyen, M. Murtuza, "Microstructural Indicators for Prognostication of Copper?Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity" IEEE Transactions on Components, Packaging and Manufacturing Technology, v.6, 2016, p.569. doi:10.1109/TCPMT.2015.2495164 

Lall, P., and J. Wei, "X-Ray Micro- CT and Digital- Volume Correlation Based Three- Dimensional Measurements of Deformation and Strain in Operational Electronics" Proceedings of the 65th ECTC, San Diego, CA, v., 2015, p.pp. 406-4.

Publications Produced as Conference Proceedings

Lall, P;Vaidya, R;More, V;Suhling, J;Goebel, K "LEADING INDICATORS OF DAMAGE FOR PROGNOSTICATION OF LEADFREE ELECTRONICS SUBJECTED TO MULTIPLE THERMO-MECHANICAL ENVIRONMENTS" ASME International Mechanical Engineering Congress and Exposition, v. , 2010, p.291 View record at Web of Science

Lall, P;Gupta, P;Angral, A;Suhling, J "FEATURE VECTOR BASED FAILURE MODE IDENTIFICATION AND PROGNOSTICATION OF ELECTRONICS SUBJECTED TO SHOCK AND VIBRATION" ASME International Mechanical Engineering Congress and Exposition, v. , 2010, p.367 View record at Web of Science

Lall, P;Lowe, R;Suhling, J;Goebel, K "PROGNOSTICATION BASED ON RESISTANCE-SPECTROSCOPY FOR HIGH RELIABILITY ELECTRONICS UNDER SHOCK-IMPACT" ASME International Mechanical Engineering Congress and Exposition, v. , 2010, p.383 View record at Web of Science

Jaeger, RC;Suhling, JC;Hussain, S;Roberts, JC;Motalab, MA;Cho, CH "STRESS MEASUREMENT ERRORS IN FLIP CHIP PACKAGES USING MULTI-ELEMENT SENSOR ROSETTES ON (111) SILICON" ASME InterPack Conference, v. , 2010, p.15 View record at Web of Science

Chen, C;Flowers, GT;Bozack, M;Suhling, J "Modeling and Analysis of a Connector System for the Prediction of Vibration-induced Fretting Degradation" 55th IEEE Holm Conference on Electrical Contacts, v. , 2009, p.129 View record at Web of Science

Lall, P;Shirgaokar, A;Arunachalam, D;Suhling, J;Strickland, M;Blanche, J "PCR FOR DERIVATION OF PARAMETER DEPENDENCIES, THERMO-MECHANICAL NORRIS-LANDZBERG ACCELERATION FACTORS, GOLDMANN FATIGUE CONSTANTS FOR LEADFREE ELECTRONICS" ASME InterPack Conference, v. , 2010, p.159 View record at Web of Science

Zhang, YF;Kurumaddali, K;Suhling, JC;Lall, P;Bozack, MJ "MATERIAL BEHAVIOR OF MIXED FORMULATION SOLDER JOINTS" ASME InterPack Conference, v. , 2010, p.335 View record at Web of Science

Lin, CA;Suhling, JC;Lall, P "EVOLUTION OF THE STRESS-STRAIN AND CREEP BEHAVIOR OF UNDERFILL ENCAPSULANTS WITH AGING" ASME InterPack Conference, v. , 2010, p.417 View record at Web of Science

Tian, GY;Lin, C;Suhling, JC;Lall, P "CURE PROFILE EFFECTS ON THE MECHANICAL BEHAVIOR AND RELIABILITY OF FLIP CHIP ON LAMINATE ASSEMBLIES" ASME InterPack Conference, v. , 2010, p.789 View record at Web of Science

Lall, P;Gupta, P;Angral, A;Suhling, J "ANOMALY-DETECTION AND PROGNOSTICATION OF ELECTRONICS SUBJECTED TO SHOCK AND VIBRATION" ASME InterPack Conference, v. , 2010, p.857 View record at Web of Science

Lall, P;Vaidya, R;More, V;Suhling, J;Goebel, K "REMAINING USEFUL-LIFE BASED ON DAMAGE PRE-CURSORS FOR LEADFREE ELECTRONICS SUBJECTED TO MULTIPLE THERMAL-ENVIRONMENTS" ASME InterPack Conference, v. , 2010, p.873 View record at Web of Science

Lall, P;Shantaram, S;Angral, A;Kulkarni, M;Suhling, J "DAMAGE ACCUMULATION AND LIFE-PREDICTION MODELS FOR SnAgCu LEADFREE ELECTRONICS UNDER SHOCK-IMPACT" ASME InterPack Conference, v. , 2010, p.887 View record at Web of Science

Lall, P;Lowe, R;Suhling, J;Goebel, K "LEADING-INDICATORS BASED ON IMPEDANCE SPECTROSCOPY FOR PROGNOSTICATION OF ELECTRONICS UNDER SHOCK AND VIBRATION LOADS" ASME InterPack Conference, v. , 2010, p.903 View record at Web of Science

Zhang, YF;Cai, ZJ;Suhling, JC;Lall, P "AGING EFFECTS ON THE MECHANICAL BEHAVIOR AND RELIABILITY OF SAC ALLOYS" ASME InterPack Conference, v. , 2010, p.959 View record at Web of Science

Roberts, J;Rahim, MK;Suhling, JC;Jaeger, RC;Lall, P;Zhang, R "CHARACTERIZATION OF DIE STRESS DISTRIBUTIONS IN AREA ARRAY FLIP CHIP PACKAGING" ASME InterPack Conference, v. , 2010, p.977 View record at Web of Science

Roberts, J;Rahim, MK;Hussain, S;Suhling, JC;Jaeger, RC;Lall, P "STRESSES IN AREA ARRAY ASSEMBLIES SUBJECTED TO THERMAL CYCLING" ASME International Mechanical Engineering Congress and Exposition, v. , 2010, p.267 View record at Web of Science


Project Outcomes Report

Disclaimer

This Project Outcomes Report for the General Public is displayed verbatim as submitted by the Principal Investigator (PI) for this award. Any opinions, findings, and conclusions or recommendations expressed in this Report are those of the PI and do not necessarily reflect the views of the National Science Foundation; NSF has not approved or endorsed its content.

The CAVE3 Research Center has operated through Phase-I, Phase-II and Phase-III of NSF-IUCRC program.  Outcomes of the center project have made a measurable and positive impact on design, development, and manufacture of electronic modules for operation in harsh environments. The electronic assemblies must operate reliably for long periods of time in hostile environments including extreme high temperatures and low temperatures, large temperature swings, high humidities, and exposure to corrosive fluids.  The results from center projects in the areas of damage mechanics, physics of failure, materials science, and manufacturing processes have helped identify a number of key factors, which have impaired progress in enhancing product longevity. Studies to understand factors, which impact the survivability in high-g mechanical shock and vibration, the aging induced microstructure and crack propagation rates in solder joints, as well as the growth kinetics of brittle inter-metallic compounds have led to significant process improvements in flip-chip and ball-grid array component reliability. Prognostics health management methods have been developed to identify impending failure in functional electronics systems and provide means for repair and replacement.  Methodologies have been developed to inhibit crack propagation in solder joints by controlling several critical design variables during soldering operations and module assembly processes. This has led to a set of design guidelines and a decision support toolkit for area array packaging.  Theoretical and experimental studies of the heat transfer in populated printed circuit boards using finite element simulations and miniature temperature sensors have led to identification of heat-susceptible locations that impact circuit reliability. This has been especially useful for manufacturing a variety of electronic modules for ground vehicles that are mounted on the engine block or embedded in the transmission. 

 


Last Modified: 07/18/2017
Modified by: Pradeep Lall

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